Multilayer Printed Circuit Boards

In printed circuit board fabrication, the end products are classified as single-sided, double-sided or multilayered, based on the number of wiring surfaces. On a multilayered board, insulating layers separate multiple conductive layers.

The Technology Behind Printed Circuit Board Fabrication

As technology improves, multilayer printed circuit board fabrication changes to allow for easier electrical connections. By using circuit CAD (computer-aided design) software, the relationship between the layers can be tested and improved. The final design files are then given to a manufacturer for production. For less complex circuitry, a PC board with manual wiring is still possible in a multilayer setup.

How Do the Layers Interact?

During the manufacturing process, small holes, or vias, drilled into the prepreg boards connect layers and conduct electricity. Plated-through holes created by riveting or electroplating form the electrical pathway. The holes may not connect to all layers, but can simplify the design and manufacturing process regardless. Non-visible conductive holes, called buried vias, are available on some high-density PCBs. It is common to have the drilled areas visible on only one side, which is called a blind via.

Almatron offers custom design and fabrication of two- to six-layer printed circuit boards. By working closely with small companies who may not meet minimum order requirements for most offshore manufacturers, the Santa Ana-based company provides optimal customer service and price points without sacrificing quality.